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Although horizontal PTH cross sections are usually more accurate for plating thickness, interconnection separation, and annular ring measurements, they do not allow adequate inspection of other attributes such as voids, plating uniformity, adhesion, etchback, and nodules. Surface plating thickness measurements are taken from vertical cross sections of conductor areas. Microsection mounts are usually etched with an appropriate etchant to show grain boundaries between the copper-clad foil and copper plating and to remove copper smearing introduced during the polishing process. 51.11.2.1.1 Thermal Stress Solder Float Test. Soldering temperatures expose PCBs to thermal and mechanical stress and may deform the PCB shape and cause premature degradation of the base material. Thermal stress inspection is performed to predict the acceptability of the PCBs after the assembly and rework process. PTH degradation, separation of platings or conductors, and base material delamination are induced or amplified by the thermal stress test. The PCB specimen is oven-conditioned to reduce moisture, placed in a dessicator on a ceramic plate to cool, fluxed, floated in a solder bath, and placed on an insulator to cool. Visual inspection for imperfections is followed by microsectioning of the PTHs and inspection under a microscope for integrity. Test coupons are typically used for thermal stress inspection. rdlc upc-a UPC-A Generator DLL for VB.NET Class - Generate Barcode in VB ...
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Net is a port of ZXing, an open-source, multi-format 1D/2D barcode image ..... Linear, Postal, MICR & 2D Barcode Symbologies - ReportViewer RDLC and . 51.11.2.2 Microsection Evaluation. The evaluation of internally observable attributes in the microsection consists of the following set of inspections: Subsurface attributes in the PCB material such as delamination, blistering, cracks, ground plane clearance, and layer-to-layer spacing Internal conductor attributes including over- and under-etch, conductor cracks and voids, and foil thickness PTH attributes including size, annular ring, plating thickness, plating voids and nodules, plating cracks, resin smear, etchback, wicking, innerlayer (post) separation, and solder thickness rdlc upc-a Packages matching RDLC - NuGet Gallery
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Draw and Print Dynamic UPC-A / UPC-A Supplement 2/5 Add-On in Report Definition Language Client-side/ RDLC Report | Free to download trial package ... 51.11.2.3 Subsurface Imperfections in the PCB Material 51.11.2.3.1 Base Material Voids after Thermal Stress. Heat from soldering operations will transfer quickly through the copper holes and pads in a PCB to the base material in close proximity to the copper. This rapid heat movement can easily cause imperfections to occur in the base material and this area near the holes is exempted from evaluation for base material imperfections. This area is defined as the thermal zone and described in detail by IPC-A600. Outside this thermal zone, base material voids should not exceed 0.08 mm for rigid PCBs and 0.5 mm for flexible PCBs or flexible portions of rigid-flexible PCBs. Base material voids found in the same plane of flexible or rigid-flexible PCBs should not have a combined dimension greater than 0.5 mm (see Fig. 51.20). The thermal A zone. (Courtesy of IPC.) rdlc upc-a Linear Barcodes Generator for RDLC Local Report | .NET program ...
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In the following guide we'll create a local report ( RDLC file) which features barcoding capabilities by using Bytescout Barcode SDK. Follow these steps:. 51.11.2.3.2 Clearance of Holes to Power/Ground Planes. Electrical isolation between power/ground planes and nonconnected holes is necessary to ensure that shorting does not occur. This is especially true with holes that are nonplated and used for mounting of the PCB to a frame, as without proper clearance, the mounting hardware can cause shorting to the frame or between power and ground.The minimum distance of this clearance should reflect the minimum electrical spacing requirement on the procurement documentation (see Fig. 51.21). 51.11.2.3.3 Delamination and Blistering. Delamination or blistering observed in the microsection is a nonconforming condition and the inspection lot should be rescreened in accordance with the externally observable visual requirements for delamination and blistering set forth earlier in this chapter. FIGURE 51.21 Clearance between PTH and power/ground plane. (Courtesy of IPC.) 51.11.2.3.4 Resin Smear. Resin smear is transferred from the base material onto the surface or edge of the internal conductive pattern during the drilling process. Excessive heat generated during drilling softens the resin in holes and smears it over the exposed internal copper areas. This condition creates a resin insulator between the internal land and subsequent plating in the holes, and the result is open or poorly connected circuits. The imperfection is removed from the holes by chemical or plasma cleaning prior to metallization. Inspection for resin smear is performed by viewing vertical and horizontal microsections of PTHs and any evidence of it is nonconforming. (See Fig. 51.22 for an example of resin smear prior to etchback.) Keep your hand gestures between your chin and your waist. Once gesturing becomes second nature to you, you ll lose the self-consciousness, just as public-speaking students do. When you ve watched yourself gesturing on video and made some improvements, you won t have to think about your hands anymore! FIGURE 51.22 Resin Smear in PTH, vertical microsection. (Courtesy of IPC.)
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