rdlc data matrix

rdlc data matrix

rdlc data matrix

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bow or twist allowed is 1.5 percent unless the PCB has surface-mounted devices (SMDs) attached where the requirement is reduced to a maximum allowable of 0.75 percent. 51.11.1.8.4 Cleanliness (Solvent Extract Methods). PCBs are fabricated using wet chemistry and mechanical techniques. Some of the chemical baths contain metallic salts and organic materials. These chemicals, if left on the surface, could affect the functionality of the PCBs by reducing electrical insulation resistance and promote corrosion or ECM on the conductor pattern.This condition is usually associated with low operating voltage (10 volts or less) and requires three components: moisture, metallic contaminants, and voltage. The ionic cleanliness test measures the conductivity of a de-ionized water and alcohol solution used to wash the PCB. Commercial equipment is available to perform ionic cleanliness testing. The organic cleanliness test uses an organic solvent wash (e.g., acetonitrile) to remove loose organics from the surface of the PCB. This wash solution is collected on a glass plate and the solvent is allowed to evaporate. Any organic contamination in the wash solution leaves a cloudy residue on the glass that can be subsequently analyzed for composition.These two tests are mutually exclusive in that the organic test cannot detect ionic contamination and vice-versa. Note that when a solder mask is required on PCBs, an additional cleanliness test is performed on the uncoated PCBs before coating. 51.11.1.9 Solderability Inspection. Solderability inspection measures the ability of the attachment points to be wetted by solder in the areas for the joining of components to the PCB. Three terms are used to describe acceptability of solderability:

In the culture of the United States, direct eye contact indicates trustworthiness, friendliness, and con dence. Averted eyes usually indicate just the opposite. Ask

Wetting The formation of a relatively uniform, smooth, unbroken, and adherent film of solder to a basis material, wetting is the preferred and acceptable condition. De-wetting This condition results when molten solder has coated the attachment surface and recessed, leaving irregularly shaped mounds of solder separated by areas covered with a thin film of solder that fully covers the basis metal. De-wetting is not acceptable for attachment points but is allowed on ground or voltage planes for Class 1 and 2 products. Non-wetting This nonconforming condition is the partial adherence of molten solder to a surface that it has contacted, leaving some of the basis metal exposed.

51.11.1.9.1 Solderability Testing and Coating Durability. Many methods for inspecting PCBs for solderability both quantitatively and qualitatively have been established. However, the most meaningful method is that used in the actual assembly soldering operation (hand, wave, drag, reflow soldering, etc).ANSI/J-STD-003, Solderability Tests for Printed Boards, addresses the recommended test methods and subsequent storage conditions that have no adverse effect

Suitable for a broad range of applications because of the higher decomposition temperature and overall thermal expansion being similar to standard high-Tg materials. Consider higher Tg versions for thicker, more complex PCBs. Compatible in the broadest range of designs and applications. Recommended when long-term reliability is critical.

With this information in hand, we can calculate the various components of the null vectors. We start with l a = (0, 1, 0, 0). Lowering the index, we nd la = gabl b = gav l v The only nonzero term in the metric of this form is guv = 1, and so we conclude that lu = guv l v = 1 la = (1, 0, 0, 0) (9.25)

Revision B of the IPC-4101 specification was released in June 2006.The committee responsible for this specification worked hard to add material specification sheets that included some of the properties discussed in Chaps. 10 and 11 in regards to lead-free assembly. Table 11.6 summarizes some of the new specification sheets that include properties such as decomposition temperature, z-axis expansion, and time-to-delamination values.

TABLE 11.6 New Specification Sheets in IPC-4101B Slash Sheet /101 /121 /99 /124 /126 /129 Min. Tg Filled/Unfilled 110 110 150 150 170 170 Filled NA Filled NA Filled NA Td @5% 310 310 325 325 340 340 T260 30 30 30 30 30 30 T288 5 5 5 5 15 15 T300 NA NA NA NA 2 2 Pre-Tg CTE 60 60 60 60 60 60 Post-Tg CTE CTE% 50 260 C 300 300 300 300 300 300 4.0 4.0 3.5 3.5 3.0 3.5