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The land grid array (LGA) device is a solder-less package that relies upon pressure contact to interconnect it to the board mechanically and electrically. Interconnection is accomplished through a socket or interposer that is sandwiched between the LGA integrated circuit (IC) package and the printed wiring board (PWB). The socket has compliant, conductive contacts that match the LGA and PWB contact land patterns on each. A system of insulators, stiffeners, and fasteners keeps the LGA in intimate mechanical and electrical contact with the PWB. Care in assembly and cleanliness is of utmost importance for successful pad-to-land contact and subsequent assembly reliability. The reader should be aware that there are leadless soldered packages also called land grid arrays, but this chapter will deal with the pressure-interconnect variety of leadless package. Most often, an LGA-type interconnect is used for mounting a central processor unit (CPU) chip or other active device to a PWB. It is also used for some connectors. An advantage of this type of interconnect is that it makes it possible to exchange a chip without the need to unsolder and re-solder, facilitating rapid rework, engineering changes or field upgrades without soldering and without degradation in reliability. The LGA concept has been applied to connectors also. Although the technique has been in use for several years, it is still a niche technology but will likely increase in importance as input/output (I/O) counts continue to increase and package size limitations for soldering are met.

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UPC-A - Barcode4J - SourceForge
The configuration for the default implementation is: <barcode> < upc-a > <height>{ length:15mm}</height> <module-width>{length:0.33mm}</module-width> ...

Since the LGA connection to the PWB is solderless, it is environmentally friendly, requiring no heating for solder, soldering, or rework. It is easy to move into compliance with the European Union s (EU) Restriction of Hazardous Substances (RoHS) requirements since solder considerations (at least external to the package) are absent.

There are five key elements and several subelements that make the LGA system practical and reliable.These are pictured in Fig. 50.1, but be aware that there are many variations. Key elements will be described in a generic sense in this chapter.

1 + 2

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Java UPC-A Generator | Barcode UPCA Generation in Java Class ...
UPC-A is also known as Universal Product Code version A, UPC-A Supplement 5/Five-digit Add-On, UPC-A Supplement 2/Two-digit Add-On, UPC-A +5, ...

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PWB and LGA Issues 50.3.1.1 Contact Lands. The PWB is much like any other board. It has lands to accommodate electrical interconnect of the LGA socket to the board. The lands correspond in size and shape to socket requirements. Most often, the LGA lands on the PWB are electrolytic nickel covered by electrolytic gold. Hardened gold is often used for added contact durability and reliability. Other surface finishes can also be used, but should be tested for reliable and long-lasting contact. 50.3.1.2 Drilled Holes. LGA sockets have the requirement for two sets of drilled holes in the PWB. One set is used to accommodate fastening of the bolster plate through the PWB. The second set is used to orient and retain the socket on the PWB. The closely toleranced orientation holes correspond to molded locating pins on the LGA socket and they are meant to locate the socket contacts properly on the LGA lands of the PWB. The socket manufacturer will provide guidelines and drill pattern recommendations. It is good practice to make the locating pins different sizes and to drill the PWB accordingly to polarize the socket so it cannot be misoriented on the board. 50.3.1.3 PWB Layout Considerations. There are some layout considerations such as avoidance of components in the vicinity of the LGA socket, bolster plate, and pressure plate. PWB flatness should be considered so that best contact can be made to the board once the LGA interconnect system is fully assembled.

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racca3141/UPC: Build a UPC-A label. - GitHub
27 Apr 2018 ... UPCMain . java is a command line program that takes in a 12 digit number and checks to see if it is a valid UPC-A barcode. It does this by ...

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Richard Van Alstyne stood on the big stage as he rehearsed his portion of the program for the national sales conference. His data showed just what the company needed to position itself as the leader of pharmaceutical sales. As Richard practiced, he moved his feet in a six-step pattern. He repeated those six steps over and over for twenty minutes. Richard wasn t a dynamic speaker, but he was good enough except for his annoying dance! When we gave him feedback about his feet, he brushed it aside, saying he certainly wouldn t do that during the talk. After all, this was just a rehearsal. As we made repeated suggestions for him to practice standing still, he refused. Since Richard is an executive, we could push him only so far. When Richard took the stage in front of six hundred employees, what do you think happened Yep! He danced for twenty minutes, damaging his reputation as an executive leader and weakening the message.

50.3.2 Bolster Plate LGA technology relies on a pressure interconnect system, and the bolster plate is the rigid backside element that serves to anchor the LGA system to the PWB. It is inserted through predrilled holes in the circuit board and provides the means for fastening the clamping mechanism

FIGURE 6.15 Laminate pressing with continuous copper foil and direct current heating. (Illustration Courtesy of Cedal)

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