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This version of the solder fountain incorporates a programmable head and is used mostly for first-pass soldering, but can be an effective soldering repair tool once the PTH component is removed, the site is prepped, and a new component is placed. A programmable nozzle emitting a precise jet of molten solder is directed at the leads of the component to be soldered.The nozzles allow point soldering of very fine PTH pitches. code 128 c# Create Code 128 barcodes with C# Sharp - BarCodeWiz
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NET Barcode Generator provides users with a simple but effective solution for sizing Code 128 in C# . With Code 128 C# .NET Barcode Generator, you are free to ... Laser is a recent innovation in rework and repair. The fundamentals of laser for initial soldering or for repair have already been discussed in Chap. 47. In the commercial incarnation of this technique, a laser beam is quickly scanned around component leads or, package surface, in the case of area-array devices such as BGAs and chip-scale packages (CSPs). It is most effective for plastic packaged components rather than the thermally massive CBGAs, CCGAs, and so on. In this technique, the component body is heated. Otherwise, there is little difference between this and alternative rework or repair techniques. Since the energy of the laser beam is more tightly confined to the area it irradiates, the heating is more localized. This can be advantageous when trying to remove or replace a component on a densely populated, double-sided PCA. Otherwise, the same caveats must be kept in mind regarding IMC formation and pulling components before they are fully reflowed. Care must be taken to assess carefully the assembly for laser damage threshold so as not to char components or PCAs during either removal or component resoldering. code 128 rendering c# Code 128 C# SDK - Print Code 128 barcode in C# with source code
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10 Jun 2006 ... Create Code128 barcodes for WinForms or ASP.NET. ... If TDD in C# has developed a good answer to that, I haven't yet stumbled upon it. 1 n r = grr 2 1 n a = (1, 1, 0, 0) 2 And so we have n n = n a n a = Now we compute l n = l a na = 1 2 1 2 48.6.1 Mixing Aqueous With No-Clean Chemistries Care must be taken when using fluxes for the rework and repair processes. If an aqueousclean solder chemistry is used for building the PCA, then either no-clean or aqueous flux formulations can be used. If an aqueous chemistry is used for the repair, then the board must be subjected to another aqueous cleaning cycle. Be sure to check that all components at that stage are compatible with the aqueous cleaning process. No-clean solder flux formulations can be used for rework and repair even if the PCA was manufactured with an aqueous clean chemistry, although the reverse is not recommended. Sometimes when a no-clean board is subjected to an aqueous cleaning, the no-clean flux residue takes on a white, gummy characteristic that is conducive to dendritic corrosion, which can result in soft or hard electrical shorting. Saponified aqueous cleaning can be used, but must be tested for effectiveness in removing the polymerized flux residue from the no-clean process and for compatibility with the selected no-clean flux to avoid generation of corrosive byproducts.This is particularly important under connectors, area-array devices, and other components with low headroom between the underside of the body and the PWB surface. Pooled Flux Another consideration with no-clean solder chemistries is that of pooled, unactivated flux residue. No-clean solder flux is generally harmless after it has gone through the thermal cycle associated with solder reflow. It is activated and denatured by the heat. If the flux is applied generously and the flux pool does not see the high temperatures associated with solder joint formation, acids remaining in the unheated flux residue can cause reliability problems. These acids are normally denatured, evaporated, or sublimed through the high-temperature excursions of the soldering process. If the flux acids remain, corrosion can occur in the long term. There are commercial flux solvents that can be used to dilute and wash away excess flux; otherwise, the assembly can be baked briefly to about 120 C to denature the flux. Check with the flux manufacturer for specific recommendations regarding flux residue management. The problem can be avoided by eliminating the use of liquid flux and using small amounts of paste flux instead. In the case of core wire, use the smallest diameter practical to limit flux residue. code 128 generator c# Code 128 C# Control - Code 128 barcode generator with free C# ...
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