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assembly, with higher values generally preferred. Advanced FR-4 resin systems can combine both high-Tg and high- Td. This will be discussed in detail in Chap. 10. In addition, higher Tg resin systems can be harder and more brittle than lower Tg systems. This can adversely affect productivity in the printed circuit manufacturing process. In particular, the drilling process can be affected as slower drilling, reduced drill bit life or reduced stack heights can be required for high-Tg materials. Lower copper peel strength values and shorter times to delamination can also be correlated with higher Tg values, though other factors influence these properties as well. The time to delamination is a measure of the time it takes for the resin and copper, or resin and reinforcement, to separate or delaminate, and can be correlated to Td. This will also be discussed in Chaps. 8 and 10, in the context of lead-free assembly. This time-to-delamination test utilizes TMA equipment to bring a sample to a specified temperature and then measures the time it takes for failure to occur. Failure is typically delamination between the resin and copper foil, or resin and glass within the laminate. Temperatures of 260 C (T260) and 288 C (T288) are commonly used for this testing.

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Decomposition Temperature, Td As a material is heated to higher temperatures, a point is reached where the resin system will begin to decompose. The chemical bonds within the resin system will begin to break down and volatile components will be driven off, reducing the mass of the sample. The decomposition temperature, Td, is a property which describes the point at which this process occurs. The traditional definition of Td is the point where 5 percent of the original mass is lost to decomposition. However, 5 percent is a very large number when multilayer PCB reliability is considered, and temperatures where lower levels of decomposition occur are very important to understand, particularly with respect to lead-free assembly. To illustrate this, consider Fig. 6.4. In Fig. 6.4, you can see curves for two FR-4 materials.The traditional FR-4, a 140 C Tg material in this case, has a decomposition temperature of 320 C by the 5 percent weight loss definition. The enhanced FR-4 has a decomposition temperature of 350 C by the 5 percent weight loss definition. Many standard high-Tg FR-4 materials actually have decomposition

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Lastly, I also spend time observing the behavior of the participants prior to the beginning of the session as well as on breaks I seek insight into who comes across as con dent, humorous, compassionate, or even disengaged In response, I compliment con dence, stroke displays of compassion, ask a question of the disengaged, and work for laughs Tell compelling stories There is no better way to bring theory to reality than through a compelling story Have a moral that ties directly to the content of your presentation For emphasis, engage all the presentation skills you know, such as voice in ection, facial and hand gestures, and appropriate wording Remember, you are not just telling a story but painting a visual for the audience Incorporate appropriate humor Getting people to laugh will lighten the mood in the room.

100 95

FR-4 nced Enha 4 l FR-

Weight %

210

270

Typical Lead-free Temperature Sn/Pb assembly assembly temperature temperature range range 240 C-270 C 210 C-245 C

320 350 C

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and EMC, provided all critical conductors are buried (lands only) on outer layer(s) of the printed board assembly. Separation of Grounds. The identification and separation of natural groupings of grounds into similar requirements increases the assurance of conformance to product definition requirements. Some of the natural groupings are as follows:

Electrical safety ground Power supply ground Low-level analog ground High-level analog ground Digital ground I/O ground Pulsed power/energy ground

When defining the printed circuit design requirements for a particular assembly, results of an analysis of the grounding elements necessary for proper functional performance must be included 15533 Bypass Capacitors The selection, location, number, and value of the bypass capacitor(s) for PCDs can affect functional circuit performance The purpose of the bypass capacitor is to provide the necessary electrical energy to minimize the effect of a component s normal transient switching and load currents during functional operation The selection, location, and placement of the bypass capacitor can have a significant impact on EMC and a lesser impact on functional performance One of the keys to EMC management is to prevent or minimize the generation and subsequent radiation of electromagnetic fields in the first place 15534 Voltage and Ground Buses.

Our goal is to get all terms on one side and all terms on the other. We can do this by adding 2 cos2 f ( ) d to both sides and then move the g ( ) on the left-hand side over to the right. When we do this, we get this equation f ( ) d + f ( ) = 2 cot g ( ) g ( ) If you think back to your studies of partial differential equations, the kind where you used separation of variables, you will recall that when you have an equation in one variable equal to an equation in another variable, they must both be constant. So we will do that here. Let s call that constant k. Looking at the

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