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Solder Application The use of solder paste is discouraged because blade heatup is fast and may result in explosive solder ball formation from rapidly volatilized paste constituents. Also, the paste is likely to squeeze out from between the component lead and circuit board pad, which can cause the solder to bridge to adjacent conductors. In fact, even with solid solder coatings on the circuit board, bridging can be problematic in hot-bar bonding. This is usually a function of the volume of solder on the pad, the quantity of flux, its degree of activity, and lead-pad pitch. As the

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solder is melted and displaced by the hot-bar, it bulges laterally to the point that the solder masses of two or more adjacent pads may touch one another, forming a solder bridge. Once the bridge has formed, the forces associated with lead-pad wetting and capillarity may not be strong enough to overcome the surface tension conditions established during bridge formation. If that is the case, the bridging defect(s) will persist (Fig. 47.37).

FIGURE 47.37 As the hot-bar is forced into contact with component leads and circuit board pads (a), the solder may bulge laterally as shown in (b), resulting in solder bridges (c). Careful control of solder volume, applied pressure, and temperature profile during hot-bar soldering is required to preclude this defect.

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Solid solder coatings such as hot air-leveled pads, solder-plated boards, or stenciled solder paste reflowed prior to hot-bar bonding are preferred for this bonding method. 47.10.2 Fluxes and Fluxing for Hot-Bar Soldering Soldering flux is applied prior to component placement and soldering. Flux choice should be tailored to the hot-bar process. The flux can be either liquid or paste. The flux chosen should be tested to resist charring and the development of polymerized decomposition products, or lacquers, which adhere to both circuit board and hot-bar. Residue build-up on the bar can adversely inhibit hot-bar performance by diminishing thermal transfer. The residue can also become thick and uneven enough to prevent the hot-bar from squarely contacting component leads. Baked-on aqueous-clean flux residues can make flux cleaning difficult.With no-clean flux, overheated residues may detract from the visual appearance of the printed circuit assembly. 47.10.3 The Hot-Bar Soldering Operation Generally, the board is preheated on a hot stage beneath the hot-bar, off to the side or even in a box oven prior to soldering. Sometimes hot air is used for preheating. This step is generally done after flux application, so the thermal profile has to be adjusted to prevent flux dry-out. Once component leads are aligned with solder-coated PWB pads, the hot-bar is pressed against

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the lead-pad combinations and heated to reflow Precise control of the heating process is required to prevent flux spattering or solder bridging A mechanical stop is employed to keep the bonding head from exerting too much force on the lead and pad combination Excessive force can cause the component leads to slide off pre-reflowed (domed) solder-coated pads It can also enhance solder bridge formation and solder-starved joints by physically displacing solder from between leads and pads One approach to preventing bridged or solder-starved joints is to retract the hot-bar by several hundredths of a millimeter once the solder starts to reflow This results in a surface tension coupling of solder between lead and land, reduced propensity for solder bridge formation, and robust joint formation upon cooling As in any other soldering process, it is important to maintain proper reflow time-temperature characteristics.

In hot-bar soldering, it is of paramount importance that the blade seating plane is maintained normal to the surface place of the PWB On the other hand, it should be noted that the coplanarity of solder on the PWB pads does not have to be exactThe hot-bar will reflow this solder and it will self-planarize, as does any liquid, and remain planarized into the solid phase 47104 Hot-Bar Construction The hot-bar bonding head can be composed of one or several blades They are designed to solder one side, two sides, or all four sides of a gull-wing leaded component simultaneously Generally the hot-bar assembly is configured to accommodate the maximum span of a lead set, permitting simultaneous bonding of all leads on a package side.

In the case of some very long connectors or other large packages, the thermal uniformity of a single blade may not be adequate for the process This is sometimes remedied by using a smaller hot-bar and stepping it along the length of the lead set until all leads are bonded Another approach uses multiple hot-bars side by side, each individually controlled, to achieve the span and required thermal uniformity Bar configuration is designed for the lead form to be bonded It should sit flatly on the foot of the lead, neither contacting the radiused area of the lead form nor significantly overhanging the lead toe, as shown in Fig 4738..

(continued)