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Laser-Soldering Fundamentals There are relatively few variables associated with the laser in its application to soldering This is one of the advantages for laser processing Beam wavelength, irradiation time, and beam power are important to the process, as are the properties of the materials being joined Reflectivity, thermal conductivity, and laser damage threshold must be understood before soldering is attempted The wavelength will be fixed by the laser of choice, and the shorter the wavelength, the smaller the theoretical spot size, as discussed Generally, the reflectivity of a metal is lower at shorter wavelengths, thus a metal is more easily heated by an Nd:YAG laser than with a CO2 laser The converse is true for many polymeric materials, which are more absorptive at longer wavelengths and therefore more prone to damage with increasing wavelength Many polymeric materials are also absorptive at the UV end of the spectrum. asp.net pdf 417 ASP . NET PDF-417 Barcode Generator - Generate 2D PDF417 in ...
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Easy-to-use ASP . NET PDF417 Barcode Component, generating PDF-417 barcode images in ASP.NET, C#, VB.NET, and IIS project. A carbon dioxide laser beam is more likely to impart damage to a circuit board than the beam of an Nd:YAG laser, but either laser can inflict damage if the energy density is high enough In fact, either laser can easily cut through a component lead or drill through a circuit board if parameters are not adjusted properly The reflectivity of metals varies widely with composition and surface condition Every metal can be heated with a laser as long as the energy density of the beam and dwell time are sufficient for heating This is also the case with laser-irradiated component leads, board pads, and solder during the laser bonding process Measurements of the reflectivity of Sn-Pb solder show that a eutectic alloy can be as high as 74 percent at 106 (m or as low as 21 percent at 106 mm. asp.net pdf 417 PDF417 ASP . NET - Barcode Tools
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2 May 2019 ... NET framework. It is the second article published by this author on encoding and decoding of PDF417 barcodes. The first article is PDF417 ... Therefore, in the case of the CO2 laser at 106mm on a Sn or Sn-Pb-plated lead and solder-coated pad, much energy will have to be directed at the metals to start the absorption process, since so little laser energy is absorbed by the solder and converted to heat; the rest of the energy is lost to reflectionThe reflected or multiply reflected beam may impinge on adjacent components and damage package bodies or even the circuit board itself, causing charring Therefore, Nd:YAG is preferable for circuit board soldering.. asp.net pdf 417 ASP . NET Barcode Demo - PDF417 Standard - Demos - Telerik
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It can work with Code128, PDF417 and many other symbologies. ... annoyingly split it along technology lines ( Barcode Professional "...for ASP . Generally, the laser beam is directed at the component lead to accomplish soldering, but when the lead material is highly reflective, as would be the case with a gold-plated finish, heating is slow and irradiation times impractically long. An alternative has been demonstrated whereby the beam is directed at solder-coated circuit board bonding pad. If there is leeway in design, the bonding pad can be extended to aid in this method, dubbed throughpad bonding (see Fig. 47.33b). In contrast to the usual beam impingement on the component lead, or through-lead bonding (see Fig. 47.33a), the beam is directed at the more absorptive solder or on the circuit board land, increasing process efficiency and locally melting the solder in the vicinity of beam impingement. Since the molten solder is in intimate contact FIGURE 47.33 Laser soldering: (a) through-lead laser soldering; (b) through-pad laser soldering (B). with the lead and pad, the heat from the bonding process is efficiently transferred. The process can result in rapid soldering along the entire length of the component lead and circuit board pad with rich solder fillets evident if the process is conducted properly. l r = grr 1 2 1 = ( 1) 2 1 = 2 Single-Point Laser Soldering This method requires a laser beam that is smaller in diameter than the length or width of the component lead or bonding pad. The beam is stepped to each lead-pad combination and delivered with sufficient energy to result in solder reflow. The beam can be CW, pulsed, or multiply pulsed to accomplish soldering as long as there is enough radiation delivered to cause the solder to undergo the phase change required for soldering and wetting. Due to the small beam diameter, as required by this technique for fine-pitch components, the energy density can be exceptionally high. In fact, it can be so high that if the lead is not in good contact with the bonding pad, then the laser s beam can damage the lead, perhaps cutting through it rather than soldering it. Overly intense irradiation can also cause a bonding pad to delaminate from the PWB. In any laser soldering technique where very small spot size is required, the beam diameter must be precisely controlled. A small variation in beam diameter, either through change in laser parameters or in working distance (focus), can dramatically affect the delivered energy density. In the cases of a 10 W Nd:YAG laser beam focused to a spot of 0.1 mm (0.004 in.) and a spot of 0.2 mm (0.008 in.), this seemingly small change in spot size will result in a large change in power density (see Eq. 47.2). P = p/d where P = power density p = average power d = focused beam diameter. (47.2) asp.net pdf 417 Create PDF 417 barcode in asp . net WEB Application | DaniWeb
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